Molecular Dynamics Simulation on the Nanoindentation Behavior of a Copper Bilayered Thin Film

Abstract

Abstract: Nanoindentation is one of widely used tools for examining mechanical propert ies of metal thin films. In this study, molecular dynamics simulation was e mployed to investigate the nanoindentation behavior of a Cu(100)/Cu(110) bilayer ed thin film. The detailed deformation structure of the bilayered thin film was observed to be similar to that of its ingredients and correlated very well with the load-displacement response.

Key words: bilayered thin film, copper, nanoindentation, molecular dynamics simulation

LIAO Ming-Liang;WENG Meng-Hsiung;JU Shin-Pon*;CHIANG Hsing-Jung. Molecular Dynamics Simulation on the Nanoindentation Behavior of a Copper Bilayered Thin Film[J]. Chinese Journal of Catalysis, 2008, 29(11): 1122-1126.

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https://www.cjcatal.com/EN/Y2008/V29/I11/1122

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Molecular Dynamics Simulation on the Nanoindentation Behavior of a Copper Bilayered Thin Film

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